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` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary hybrid coupler 2 db, 90 ? description the x3c35f1 - 02s is a low profile, high performance 3 db hybrid coupler in a new easy to use, manufacturing friendly surface mount package. the x3c35f1 - 02s is designed particularly for balanced power and low noise amplifiers, plus signal distribution and other applications where low insertion loss and tight amplitude and phase balance is required. it can be used in high power applications up to 1 5 watts. parts have been subjected to rigorous qualification testing a nd they are manufactured using materials with coefficients of thermal expansion (cte) compatible with common substrates such as fr4, g - 10, rf - 35, ro4 003 and polyimide. produced with 6 of 6 rohs compliant tin immersion finish electrical specifications ** features: ? 3300 - 3800 mhz ? doherty amplifier ? high power ? very low loss ? tight amplitude balance ? high isolation ? production friendly ? tape and reel ? lead - free frequency directivity insertion loss vswr coupling mhz db min db max max : 1 db 3300 - 3800 2 1 0.2 0 1.15 1.9 0.15 phase group delay power ? jc operating temp. degrees ns avg. cw watts at 95 o c o c/watt o c 90 4.0 0.10 0.01 1 5 60 - 55 to +140 **specification based on performance of unit properly installed on anaren test board with small signal applied. specifications subject to change without notice. refer to parameter definitions for details. mechanical outline rr cc x3c 35f1-02s
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d hybrid coupler pin configuration the x3c35f1 - 02s has an orientation marker to denote pin 1. once port one has been identified the other ports are known automatically. please see the chart below for clarification: configuration pin 1 pin 2 pin 3 pin 4 splitter input isolated - 5 db - 2 db splitter isolated input - 2 db - 5 db splitter - 5 db - 2 db input isolated splitter - 2 db - 5 db isolated input 90 ? ? ? ? ? ? ? 90 ? ? ?
` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary insertion loss and power derating curves insertion loss derating: the insertion loss, at a given frequency, of a group of couplers is measured a t 25 ? c and then averaged. the measurements are performed under small signal conditions (i.e. using a vector network analyzer). the process is repeated at 9 5 ? c and 1 4 0 ? c. a best - fit line for the measured data is computed and then plotted from - 55 ? c to 1 4 0 ? c. power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mounting surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insert ion loss. the thermal insertion loss is defined in the power handling section of the data sheet. as the mounting interface temperature approaches the maximum continuous operating temperature, the power handling decreases to zero. if mounting temperatu re is greater than 95 ? c, xinger coupler will perform reliably as long as the input power is derated to the curve above.
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d typical performance ( - 55 c , 25c , 95 c , 140 c ) 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for X3C35F1-02S (feeding port 1) -55oc 25oc 95oc 140oc 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for X3C35F1-02S (feeding port 2) -55oc 25oc 95oc 140oc 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for X3C35F1-02S (feeding port 3) -55oc 25oc 95oc 140oc 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for X3C35F1-02S (feeding port 4) -55oc 25oc 95oc 140oc
` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary typical performance ( - 55 c , 25c , 95 c , 140 c ) 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 -2.2 -2.1 -2 -1.9 -1.8 -1.7 -1.6 -1.5 frequency (mhz) coupling (db) coupling for X3C35F1-02S (feeding port 1) -55oc 25oc 95oc 140oc 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 -0.5 -0.4 -0.3 -0.2 -0.1 0 frequency (mhz) insertion loss (db) insertion loss for X3C35F1-02S (feeding port 1) -55oc 25oc 95oc 140oc 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 -50 -40 -30 -20 -10 0 frequency (mhz) directivity (db) directivity for X3C35F1-02S (feeding port 1) -55oc 25oc 95oc 140oc 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 -4 -2 0 2 4 frequency (mhz) phase balance (deg) phase balance for X3C35F1-02S (feeding port 1) -55oc 25oc 95oc 140oc
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d definiti on of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 ? system. a vswr of 1:1 is optimal. vswr = vmax = voltage maxima of a standing wave vmin = voltag e minima of a standing wave return loss the impedance match of the coupler to a 50 ? system. return loss is an alternate means to express vswr. return loss (db)= 20log insertion loss the input power divided by the sum of the power at the two output p orts. insertion loss(db)= 10log directivity the power at the coupled port divided by the power at the isolated port. 10log phase balance the difference in phase angle between the two output ports. phase at coupled port C phase at direct port mean coupling at a given frequency ( ? n ), coupling is the input power divided by the power at the coupled port. mean coupling is the average value of the coupling values in the band. n is the number of frequencies in the band. coupling (db) = mean coupling (db) = group delay group delay is average of group delays from input port to the coupled port average ( gd - c) min max v v 1 - vswr 1 vswr ? direct cpl in p p p ? iso cpl p p ? ? ? ? ? ? ? ? ? ) ( ) ( log 10 ) ( n cpl n in n p p c ? ? ? n c n n n ? ? 1 ) ( ?
` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary notes on rf testing and circuit layout the x3c35f1 - 02s surface mount coup lers require the use of a test fixture for verification of rf performance. this test fixture is designed to evaluate the coupler in the same environment that is recommended for installation. enclosed inside the test fixture, is a circuit board that is fabr icated using the recommended footprint. the part being tested is placed into the test fixture and pressure is applied to the top of the device using a pneumatic piston. a four port vector network analyzer is connected to the fixture and is used to measure the s - parameters of the part. worst case values for each parameter are found and compared to the specification. these worst case values are reported to the test equipment operator along with a pass or fail flag. see the illustrations below. 2db, 3 db and 5db test board test board in fixture test station test board
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d the effects of the test fixture on the measured data must be minimized in order to accurately determine the performance of the device under test. if the line impedance is anything other than 50 ? and/or there is a discontinuity at the microstrip to sma in terface, there will be errors in the data for the device under test. the test environment can never be perfect, but the procedure used to build and evaluate the test boards (outlined below) demonstrates an attempt to minimize the errors associated with t esting these devices. the lower the signal level that is being measured, the more impact the fixture errors will have on the data. parameters such as return loss and isolation/directivity, which are specified as low as 27db and typically measure at much lo wer levels, will present the greatest measurement challenge. the test fixture errors introduce an uncertainty to the measured data. fixture errors can make the performance of the device under test look better or worse than it actually is. for example, if a device has a known return loss of 30db and a discontinuity with a magnitude of C 35db is introduced into the measurement path, the new measured return loss data could read anywhere between C 26db and C 37db. this same discontinuity could introduce an insert ion phase error of up to 1 ? . there are different techniques used throughout the industry to minimize the affects of the test fixture on the measurement data. anaren uses the following design and de - embedding criteria: ? test boards have been designed and p arameters specified to provide trace impedances of 50 ? 1 ? . furthermore, discontinuities at the sma to microstrip interface are required to be less than C 35db and insertion phase errors (due to differences in the connector interface discontinuities and the electrical line length) should be less than ? 0.50 ? from the median value of the four paths. ? a thru circuit board is built. this is a two port, microstrip board that uses the same sma to microstrip interface and has the same total length (insertion phase ) as the actual test board. the thru board must meet the same stringent requirements as the test board. the insertion loss and insertion phase of the thru board are measured and stored. this data is used to completely de - embed the device under test fro m the test fixture. the de - embedded data is available in s - parameter form on the anaren website (www.anaren.com). note : the s - parameter files that are available on the anaren.com website include data for frequencies that are outside of the specified ban d. it is important to note that the test fixture is designed for optimum performance through 4.0 ghz. some degradation in the test fixture performance will occur above this frequency and connector interface discontinuities of C 25db or more can be expected. this larger discontinuity will affect the data at frequencies above 4.0 ghz. circuit board layout the dimensions for the anaren test board are shown below. the test board is printed on rog ers ro4350 material that is 0.020 thick. consider the case when a different material is used. first, the pad size must remain the same to accommodate the part. but, if the material thickness or dielectric constant (or both) changes, the reactance at the interface to the coupler will also change. second, the linewidth req uired for 50 ? will be different and this will introduce a step in the line at the pad where the coupler interfaces with the printed microstrip trace. both of these conditions will affect the performance of the part. to achieve the specified performance, se rious attention must be given to the design and layout of the circuit environment in which this component will be used. if a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance that is present on the anaren ro4350 test board. when thinner circuit board material is used, the ground plane will be closer to the pad yielding more capacitance for the same size interface pad. the same is true if the dielectric constant of the circuit board material is h igher than is used on the anaren test board. in both of these cases, narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will compensate for the extra capacitive reactance. if a thicker circuit board or one with a lower dielectric constant is used,
` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary the interface pad will have less capacitive reactance than the anaren test board. in this case, a wider section of line before the interface pad (or a larger interface pad) will introduce a shunt capacitan ce and when properly tuned will match the performance of the anaren test board. notice that the board layout for the 2db, 3db, 4db and 5db couplers is different from that of the 10db and 20db couplers. the test board for the 2 to 5db couplers has all four traces interfacing with the coupler at the same angle. the test board for the 10db and 20db couplers has two traces approaching at one angle and the other two traces at a different angle. the entry angle of the traces has a significant impact on the rf per formance and these parts have been optimized for the layout used on the test boards shown below. 2db - 5db coupler test board testing sample parts supplied on anaren test boards if you have received a coupler installed on an anaren produced microstrip test board, please remember to remove the loss of the test board from the measured data. the loss is small enough that it is not of concern for return loss and isolation/directivity, but it should certainly be considered when measuring coupling and calcula ting the insertion loss of the coupler. an s - parameter file for a thru board (see description of thru board above) will be supplied upon request. as a first order approximation, one should consider the following loss estimates: frequency band avg. ins. loss of test board @ 25 ? 869 - 894 mhz ~0.092db 925 - 960 mhz ~0.095db 1805 - 1880 mhz ~0.166db 1930 - 1990 mhz ~0.170db 2110 - 2170 mhz ~0.186db 2000 - 2500 mhz ~0.208db 2500 - 3000 mhz ~0.240db 3000 - 3500 mhz ~0.270db 3500 - 4000 mhz ~0.312db it is important to note that the loss o f the test boar d will change with temperature and must be considered if the coupler is to be evaluated at other temperatures. 6 9 7 7 2 - pf hx_ a ?.015 thru hole 2x .065 .025 typ 4x .040 (1.930) .140 (2.290)
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d peak power handling high - pot testing of these couplers during the qualification procedure resulted in a minimum breakdown voltag e of 1.25 kv (minimum recorded value). this voltage level corresponds to a breakdown resistance capable of handling at least 12db peaks over average power levels, for very short durations. the breakdown location consistently occurred across the air interfac e at the coupler contact pads (see illustration below). the breakdown levels at these points will be affected by any contamination in the gap area around these pads. these areas must be kept clean for optimum performance. it is recommended that the user te st for voltage breakdown under the maximum operating conditions and over worst case modulation induced power peaking. this evaluation should also include extreme environmental conditions (such as high humidity). orientation marker a printed circula r feature appears on the top surface of the coupler to designate pin 1. this orientation marker is not intended to limit the use of the symmetry that these couplers exhibit but rather to facilitate consistent placement of these parts into the tape and reel package. this ensures that the components are always delivered with the same orientation. refer to the table on page 2 of the data sheet for allowable pin configurations. test plan xinger couplers are manufactured in large panels and then separated. all parts are rf small signal tested and dc tested for shorts/opens at room temperature in the fixture described above . (see qualification flow chart section for details on the accelerated life test procedures.)
` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary power handling the average power handling (total input power) of a xinger coupler is a function of: ? internal circuit temperature. ? unit mounting interface temperature. ? unit thermal resistance ? power dissipated within the unit. all thermal calculations are based on the following assu mptions: ? the unit has reached a steady state operating condition. ? maximum mounting interface temperature is 95 o c. ? conduction heat transfer through the mounting interface. ? no convection heat transfer. ? no radiation heat transfer. ? the material properties are constant over the operating temperature range. finite element simulations are made for each unit. the simulation results are used to calculate the unit thermal resistance. the finite element simulation requires the following inputs: ? unit material stac k - up. ? material properties. ? circuit geometry. ? mounting interface temperature. ? thermal load (dissipated power). the classical definition for dissipated power is temperature delta ( ? t) divided by thermal resistance (r). the dissipated power (p dis ) can also be calculated as a function of the total input power (p in ) and the thermal insertion loss (il therm ): (1) power flow and nomenclature for an x style coupler is shown in figure 1. ) ( 10 1 10 w p r t p therm il in dis ? ? ? ? ? ? ? ? ? ? ? ? ? ?
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d figure 1 the coupler is excited at the input port with p in (watts) of power. assuming the coupler is not ideal, and that there are no radiation losses, power will exit the coupler at all four ports. symbolically written, p out(rl) is the power that is returned t o the source because of impedance mismatch, p out(iso) is the power at the isolated port, p out(cpl) is the power at the coupled port, and p out(dc) is the power at the direct port. at anaren, insertion loss is defined as the log of the input power divide d by the sum of the power at the coupled and direct ports: note: in this document, insertion loss is taken to be a positive number. in many places, insertion loss is written as a negative number. obviously, a mere sign change equates the two quantities. (2) in terms of s - parameters, il can be computed as follows: (3) we notice that this insertion loss value includes the power lost because of return loss as well as power lost to the isolated port. for thermal calculations, we are only interested in the power lost inside the coupler. since p out(rl) is lost in the source termination and p out(iso) is lost in an external termination, they are not be inclu ded in the insertion loss for thermal calculations. therefore, we define a new insertion loss value solely to be used for thermal calculations: pin 1 pin 4 input port coupled port direct port isolated port p in p out (rl) p out (iso) p out (cpl) p out (dc) ) db ( p p p log 10 il ) dc ( out ) cpl ( out in 10 ? ? ? ? ? ? ? ? ? ? ? ) db ( s s log 10 il 2 41 2 31 10 ? ? ? ? ? ? ? ? ? ?
` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary (4) in terms of s - parameters, il therm can be computed as follows: (5) the thermal resistance and power dissipated within the unit are then used to calculate the average total input power of the unit. the average total steady state input power (p in ) therefore is: (6) where the temperature delta is the circuit temperature (t circ ) minus the mounting interface temperature (t mnt ): (7) the maximum allowable circuit temperature is defined by the properties of the materials used to constru ct the unit. multiple material combinations and bonding techniques are used within the xinger product family to optimize rf performance. consequently the maximum allowable circuit temperature varies. please note that the circuit temperature is not a fun ction of the xinger case (top surface) temperature. therefore, the case temperature cannot be used as a boundary condition for power handling calculations. due to the numerous board materials and mounting configurations used in specific customer config urations, it is the end users responsibility to ensure that the xinger coupler mounting interface temperature is maintained within the limits defined on the power derating plots for the required average power handling. additionally appropriate solder comp osition is required to prevent reflow or fatigue failure at the rf ports. finally, reliability is improved when the mounting interface and rf port temperatures are kept to a minimum. the power - derating curve illustrates how changes in the mounting interf ace temperature result in converse changes of the power handling of the coupler. ) ( log 10 ) ( ) ( ) ( ) ( 10 db p p p p p il rl out iso out dc out cpl out in therm ? ? ? ? ? ? ? ? ? ? ? ? ? ) ( log 10 2 41 2 31 2 21 2 11 10 db s s s s il therm ? ? ? ? ? ? ? ? ? ? ? ? ) ( 10 1 10 1 10 10 w r t p p therm therm il il dis in ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ) ( c t t t o mnt circ ? ? ?
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d mounting in order for xinger surface mount couplers to work optimally, there must be 50? transmission lines leading to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensure proper electrical performance. if either of these two conditions is not satisfied, electrical performance may not meet published specifications. overall ground is improved if a dense population of pla ted through holes connect the top and bottom ground layers of the pcb. this minimizes ground inductance and improves ground continuity. all of the xinger hybrid and directional couplers are constructed from ceramic filled ptfe composites which possess exc ellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17 - 25 ppm/ o c. when a surface mount hybrid coupler is mounted to a printed circuit board, the primary concerns are; ensuring the rf pads of the device are i n contact with the circuit trace of the pcb and insuring the ground plane of neither the component nor the pcb is in contact with the rf signal. mounting footprint coupler mounting process the process for assembling this component is a conventional su rface mount process as shown in figure 1. this process is conducive to both low and high volume usage. figure 1: surface mounting process steps storage of components: the xinger products are available in an immersion tin fin ish. ipc storage conditions used to control oxidation should be followed for these surface mount components. substrate: depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 pp m/c. this coefficient minimizes solder joint stresses due to similar expansion rates of most commonly used board substrates such as rf35, ro4003, fr4, polyimide and g - 10 materials. mounting to hard substrates (alumina etc.) is possible depending upon op erational temperature requirements. the solder surfaces of the coupler ar e all copper plated with an immersion tin f inish. solder paste: all conventional solder paste formulations will work well with anarens xinger surface mount components. solder paste can be applied with stencils or syringe dispensers. an example of a stenciled solder paste deposit is shown in figure 2. as shown in the figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part. xxfx-xxs x3c .140 [3.56] 4x .015 [0.38] 4x 50 ? transmission line multiple plated thru holes to ground 4x .039 [0.98] rr cc x3c to ensure proper electrical and thermal performance there must be a ground plane with 100% solder connection underneath the part orientated as shown with text facing up. 4x .065 [1.65] dimensions are in inches [millimeters] x3cxxfx-xxs mounting footprint
` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary figure 2: solder paste application coupler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mount techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.046 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of todays conventional refl ow methods. a low and high temperature thermal reflow profile are shown in figures 5 and 6, respectively. manual soldering of these components can be done with conventional surface mount non - contact hot air soldering tools. board pre - heating is highly reco mmended for these selective hot air soldering methods. manual soldering with conventional irons should be avoided.
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d figure 5 C low temperature solder reflow thermal profile figure 6 C high temperature solder reflow th ermal profile
` a vailable on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 model x 3c35f1 - 02s rev d preliminary qualification flow chart visual inspection n=45 mechanical inspection n=40 solderability test n=5 initial rf test n=40 solder units to test board n=20 post solder visual inspection n=20 initial rf test board mounted over temp n=20 visual inspection n=40 automated tt&r operation n=45 thermal sh ock n=40 post shock rf test n=40 moisture resistance n=40 reflow / resistance to solder heat n=20 (loose) bake units n=40 micro section n = 2 visual inspection n=40 life test n=3 final rf test n=3 rf test n = 20 (loose), n = 20 (mounted ove r temp) voltage breakdown n=10 visual inspection n=10 rf test n=10 micro section n = 1 loose control, n = 1 mounted control, n = 3 board mounted, n = 3 loose visual inspection n=45
usa/canada: toll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. mod el x3c35f1 - 02s rev d packaging and ordering information parts are available in reel s. packaging follows eia 481 - d for reels. parts are oriented in tape and reel as shown below. tape and reel is availabl e in 4000 pcs per reel. section a-a .472 [12.00] .069 [1.75] a a .217 [5.50] .315 [8.00] .079 [2.00] .157 [4.00] .012 [0.30] .071 [1.80] direction of part feed (loading) .213 [5.40] .138 [3.50] rr cc xxfx-xxs x3c ?.059 [?1.50] dimensions are in inches [millimeters] b ?a ?c reel dimensions (inches [mm]) table 1 ?a 13.0 [330.0] b .945 [24.0] ?c 4.017 [102.03] ?d 0.512 [13.0]

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